Atsugi, Japan — Sony Semiconductor Solutions Corporation today announced that, starting in February 2024, it has begun the operations with several production lines at the new fab built on the premises of Sony Device Technology (Thailand) Co., Ltd. (“SDT”), a production center responsible for assembly processes of semiconductors. The opening ceremony was held today, officiated by top executives from Sony Semiconductor Solutions Group led by Terushi Shimizu, President and CEO of Sony Semiconductor Solutions and Yoshihiro Yamaguchi, President of Sony Semiconductor Manufacturing, SDT Managing Director Takeshi Matsuda. It was witnessed by guests including Japan’s Ambassador to Thailand, Mr. Masato Otaka, Mr. Wirat Tatsaringkansakul, BOI Deputy Secretary General and other VIPs.

WASHINGTON, March 27 (Reuters) - The United States is asking allies to stop domestic companies from servicing certain chipmaking tools for Chinese customers, a U.S. commerce department official said on Wednesday, as it ramps up efforts to hobble China's chipmaking capabilities.

China introduced new guidelines aimed at blocking Intel and AMD chips in government PCs and servers, the Financial Times reported on Sunday.
The procurement guidance also seeks to sideline Microsoft’s Windows operating system and foreign-made database software in favor of Chinese solutions, the report said.
China has been boosting its domestic semiconductor industry as it seeks to reduce reliance on foreign technology.

Munich, March 22, 2024 – Siltronic AG (MDAX/TecDAX: WAF) plans to gradually cease production of polished and epitaxial small diameter wafers at its Burghausen site. The process, which excludes unpolished wafers, is set to be completed in the course of 2025.

KLA, a key US supplier of semiconductor defect inspection and metrology systems, is the only big US tool company to be present
Lam Research and Applied Materials have sponsored Semicon China for the second consecutive year but neither have a physical presence

Federal government benefits help Intel advance American semiconductor manufacturing and technology leadership.

Taipei, March 18 (CNA) Vice Premier Cheng Wen-tsan (鄭文燦) announced on Monday that contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) will build two advanced IC packaging plants in Chiayi County, southern Taiwan.

Cheng made the announcement during a trip to Chiayi accompanied by TSMC Vice President for operations and facility Arthur Chuang (莊子壽), and other ranking government officials including Economics Minister Wang Mei-hua (王美花), adding that the first IC packaging plant using the sophisticated Chip on Wafer on Substrate (CoWoS) technology in Chiayi is scheduled to break ground in May.

TOKYO, March 18 (Reuters) - Taiwan's TSMC (2330.TW), opens new tab is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan's efforts to reboot its semiconductor industry.

The US plans to award more than US$6 billion to Samsung Electronics Co, helping the chipmaker expand beyond a project in Texas it has already announced, people familiar with the matter said.

ROME, March 14 (Reuters) - Intel (INTC.O), opens new tab has postponed plans to invest in Italy, the country's industry minister said on Thursday, after a project to build an advanced packaging and chip assembly factory first mooted in March 2022 was never finalised.