Internal disagreements over the direction of the Apple car led the effort to sputter for years before it was canceled this week.

Premstaetten, Austria, and Munich, Germany (28 February 2024) - ams OSRAM revises its microLED strategy with unexpected cancellation of cornerstone project. A non-cash impairment charge of EUR 600-900m, a slightly revised mid-term revenue CAGR of 6-8% on a like-for-like basis, and a positive impact to its cash-flow profile within the next 24 months is expected.

WASHINGTON, D.C. — The U.S. Department of Energy’s (DOE) Office of Electricity (OE) today launched the American-Made Silicon Carbide (SiC) Packaging Prize. This $2.25 million contest invites competitors to propose, design, build, and test state-of-the-art SiC semiconductor packaging prototypes to enable these devices to work more effectively in high-voltage environments such as energy storage. The prize is part of the American-Made Challenges program, which fosters collaboration between our nation’s entrepreneurs and innovators, DOE’s National Labs, and the private sector.

KUMAMOTO, Japan, Feb. 24, 2024 – TSMC (TWSE: 2330, NYSE: TSM) today held an opening ceremony for its majority-owned subsidiary Japan Advanced Semiconductor Manufacturing, Inc. (JASM) in Kumamoto Prefecture, Japan, bringing together suppliers, customers, business partners, academia and the Japanese government to show appreciation for their continued support and the joint effort that led to the success of the project.

TOKYO, Japan, February 23, 2024 ― Renesas Electronics Corporation (TSE: 6723, “Renesas”) today announced that it has terminated the previously announced Memorandum of Understanding (“MOU”) between Renesas and Sequans Communications S.A. (NYSE: SQNS, “Sequans”), pursuant to which Renesas had made a tender offer to purchase all of the issued and outstanding ordinary shares of Sequans for $0.7575 per ordinary share and American Depositary Shares (“ADSs”) of Sequans for $3.03 per ADS (each ADS representing four ordinary shares) in cash. The previously announced tender offer has also been terminated by Renesas.　

Munich and Taipei – 22 February, 2024 – Infineon Technologies AG and ASE Technology Holding Co., Ltd. today announced that definitive agreements were signed under which Infineon will sell two backend manufacturing sites, one in Cavite, Philippines and one in Cheonan, South Korea, to two fully owned subsidiaries of ASE, a leading provider of independent semiconductor manufacturing services in assembly and test. The plants currently run under the entity names Infineon Technologies Manufacturing Ltd. – Philippine Branch (Cavite) and Infineon Technologies Power Semitech Co., Ltd. (Cheonan) and will be acquired by ASE Inc. and ASE Korea Inc. respectively. Post the transaction, ASE will assume operations with current employees, and further develop both sites to support multiple customers. As such, ASE and Infineon have also concluded long-term supply agreements under which Infineon will continue to receive previously established services as well as services for new products to support its customers and fulfill existing commitments.

Today, the U.S. Department of Energy’s (DOE) Loan Programs Office (LPO) announced a conditional commitment to SK Siltron CSS, LLC for a $544 million loan to expand American manufacturing of high-quality silicon carbide (SiC) wafers for electric vehicle (EV) power electronics. SiC semiconductors are designed for high-voltage use and are critical components of EV drivetrains, including inverters, and electrical distribution systems like onboard chargers and DC-to-DC converters. The project is expected to create up to 200 construction jobs in the build-out phase and up to 200 skilled, good-paying operations jobs at full production at the SK Siltron CSS facility located in Bay City, Michigan. The facility is projected to be among the top-five manufacturers of SiC wafers globally, boosting America’s manufacturing competitiveness and expanding our global leadership in the clean energy technologies of the future.

SAN JOSE, Calif., Feb. 21, 2024 – Intel Corp. (INTC) today launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade. The company also highlighted customer momentum and support from ecosystem partners – including Synopsys, Cadence, Siemens and Ansys – who outlined their readiness to accelerate Intel Foundry customers’ chip designs with tools, design flows and IP portfolios validated for Intel’s advanced packaging and Intel 18A process technologies.

Intel announces expanded process roadmap, customers and ecosystem partners to deliver on ambition to be the No. 2 foundry by 2030.

Company hosts Intel Foundry event featuring U.S. Commerce Secretary Gina Raimondo, Arm CEO Rene Haas and Open AI CEO Sam Altman and others.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it will deliver the next generation Arm® Cortex™-X CPU optimized on Samsung Foundry’s latest Gate-All-Around (GAA) process technology. This initiative is built on years of partnership with millions of devices shipped with Arm CPU intellectual property (IP) on various process nodes offered by Samsung Foundry.

This collaboration sets the stage for a series of announcements and planned innovation between Samsung and Arm. The companies have bold plans to reinvent 2-nanometer (nm) GAA for next-generation data center and infrastructure custom silicon, as well as a groundbreaking AI chiplet solution that will revolutionize the future generative artificial intelligence (AI) mobile computing market.