HSINCHU, Taiwan, R.O.C., Feb. 6, 2024 – TSMC (TWSE: 2330, NYSE: TSM), Sony Semiconductor Solutions Corporation (“SSS”), DENSO Corporation (“DENSO”) and Toyota Motor Corporation (“Toyota”) today announced further investment into Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan, to build a second fab, which is scheduled to begin operation by the end of the 2027 calendar year. Toyota will also take a minority stake. Together with JASM’s first fab, which is scheduled to begin operation in 2024, the overall investment in JASM will exceed US$20 billion with strong support from the Japanese government.

Kioxia Corporation and Western Digital Corporation (NASDAQ: WDC) announced today that their joint venture manufacturing facilities at Yokkaichi and Kitakami plants have been approved to receive an up to 150 billion yen subsidy, including facilities that will produce its latest generation of 3D flash memory based on the innovative wafer bonding technology and future generation advanced nodes. The subsidy will be granted under a designated government program aimed at facilitating corporate investment in cutting-edge semiconductor production facilities and securing stable production of semiconductors in Japan. This marks the second time that Kioxia’s and Western Digital’s joint venture manufacturing facilities are receiving this subsidy from the Japanese government. Previously, the joint venture manufacturing facility at Yokkaichi was approved to receive up to 92.9 billion yen subsidy from the Japanese government in 2022.

HSINCHU, Taiwan, R.O.C., Feb. 6, 2024 – TSMC (TWSE: 2330, NYSE: TSM), Sony Semiconductor Solutions Corporation (“SSS”), DENSO Corporation (“DENSO”) and Toyota Motor Corporation (“Toyota”) today announced further investment into Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan, to build a second fab, which is scheduled to begin operation by the end of the 2027 calendar year. Toyota will also take a minority stake. Together with JASM’s first fab, which is scheduled to begin operation in 2024, the overall investment in JASM will exceed US$20 billion with strong support from the Japanese government.

WASHINGTON—Feb. 5, 2024—The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $526.8 billion in 2023, a decrease of 8.2% compared to the 2022 total of $574.1 billion, which was the industry’s highest-ever annual total. Sales picked up during the second half of 2023. In fact, fourth-quarter sales of $146.0 billion were 11.6% more than the total from the fourth quarter of 2022 and 8.4% higher than the total from third quarter of 2023. And global sales for the month of December 2023 were $48.6 billion, an increase of 1.5% compared to November 2023 total. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

Feb 1 (Reuters) - Intel (INTC.O), opens new tab is delaying the construction timeline for its $20 billion chipmaking project in Ohio amid market challenges and the slow rollout of U.S. grant money, the Wall Street Journal reported on Thursday.

Feb 1 (Reuters) - South Korean chipmaker SK Hynix (000660.KS), opens new tab has chosen the state of Indiana for a cutting-edge facility in the United States, the Financial Times reported on Thursday.

SANTA CLARA, Calif., and TAIPEI, Taiwan, ROC, Jan. 25, 2024 – Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile, communication infrastructure and networking. The long-term agreement brings together Intel’s at-scale U.S. manufacturing capacity and UMC’s extensive foundry experience on mature nodes to enable an expanded process portfolio. It also offers global customers greater choice in their sourcing decisions with access to a more geographically diversified and resilient supply chain.

What’s New: Today, Intel celebrated the opening of Fab 9, its cutting-edge factory in Rio Rancho, New Mexico. The milestone is part of Intel's previously announced $3.5 billion investment to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Intel’s breakthrough 3D packaging technology, Foveros, which offers flexible options for combining multiple chips that are optimized for power, performance and cost.

Munich, Germany and Durham, N.C. – January 23, 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a global semiconductor leader in power systems and IoT, and Wolfspeed, Inc. (NYSE: WOLF), a global leader in silicon carbide technology, today announced the expansion and extension of their existing long-term 150mm silicon carbide wafer supply agreement, originally signed in February 2018. The extended partnership includes a multi-year capacity reservation agreement. It contributes to Infineon’s general supply chain stability, also with regard to the growing demand for silicon carbide semiconductor products for automotive, solar and EV applications and energy storage systems.

Munich, Germany and Malta, NY, USA – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and GlobalFoundries (Nasdaq: GFS) (GF) today announced a new multi-year agreement on the supply of Infineon’s AURIX™ TC3x 40 nanometer automotive microcontrollers as well as power management and connectivity solutions. The additional capacity will contribute to secure Infineon’s business growth from 2024 through 2030.