The semiconductor giant has now delayed both upcoming Arizona projects as it deals with labor and licensing issues.

BENGALURU/TAIPEI, Jan 18 (Reuters) - Taiwan's Foxconn (2317.TW), opens new tab will partner with tech firm HCL Group for a semiconductor assembly and testing facility in India, the companies said on Thursday. The firms will set up an outsourced assembly and testing (OSAT) unit in the south Asian nation.
An OSAT plant packages, assembles and tests foundry-made silicon wafers, turning them into finished semiconductor chips.

Foxconn said in a regulatory filing that its India unit will own a 40% stake in the joint venture with a $37.2 million investment. HCL did not disclose financial details from its side.

Samsung Electronics and SK hynix will build the world’s largest and best semiconductor mega cluster in the southern part of Gyeonggi Province with a total investment of 622 trillion won. The Korean government will support this project by creating infrastructure and an investment environment, strengthening the semiconductor ecosystem and securing super-wide gap technologies and excellent human resources.

TEMPE, Ariz.--(BUSINESS WIRE)--Jan. 16, 2024-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility on January 16, 2024.

Since February 2023, GF has transferred 50 tools from its Dresden site to Amkor in Porto, with first customer products being qualified on the newly installed GF tools.

LAS VEGAS, U.S. -- Artificial intelligence is front and center at the CES technology trade show as chipmaking giants battle to roll out the world's most powerful AI chips.

U.S. company Nvidia, which has dominated the AI chip market since last year, unveiled three new graphics processing units (GPUs) on Monday at a virtual event before CES officially kicked off.

Nvidia says its three new GPUs -- RTX 4060 Super, RTX 4070 Ti Super and RTX 4080 Super -- will be used to power "AI-ready laptops." Several PC makers, including Acer, Dell, HP, Lenovo and Samsung, unveiled new models equipped with Nvidia's latest chips at the event.

TOKYO - Renesas Electronics Corporation (“Renesas,” TSE: 6723), a premier supplier of advanced semiconductor solutions, and Transphorm, Inc. (“Transphorm,” Nasdaq: TGAN), a global leader in robust gallium nitride (“GaN”) power semiconductors, today announced that they have entered into a definitive agreement pursuant to which a subsidiary of Renesas will acquire all outstanding shares of Transphorm’s common stock for $5.10 per share in cash, representing a premium of approximately 35% to Transphorm’s closing price on January 10, 2024, a premium of approximately 56% to the volume weighted average price over the last twelve months and a premium of approximately 78% to the volume weighted average price over the last six months. The transaction values Transphorm at approximately $339 million. The acquisition will provide Renesas with in-house GaN technology, a key next-generation material for power semiconductors, expanding its reach into fast-growing markets such as EVs, computing (data centers, AI, infrastructure), renewable energy, industrial power conversion and fast chargers/adapters.

‘COMING TO LIFE’: The annual tech show features some exciting innovation, some boring innovation, and some weird innovation, but all infused with artificial intelligence.

From self-driving baby carriages to ChatGPT in Volkswagen cars, artificial intelligence (AI) is expected to be center stage at the CES gadget extravaganza that formally opened yesterday in Las Vegas.

The annual Consumer Electronics Show boasts more than 3,500 exhibitors and is expecting around 130,000 visitors.

Companies big and small hosted previews for the media on Monday, with AI a repeated mantra as they pitched products promising better lives.

Christian Koitzsch, former plant manager of Bosch’s semiconductor facility in Dresden, has transitioned to a new role as the president of TSMC’s European Semiconductor Manufacturing Company (ESMC).

On Friday, Intel announced that it had received the first major components of ASML's extreme ultraviolet (EUV) lithography tool. The two companies will begin assembling the machine shortly as Intel hopes to be the first company to use High-NA EUV equipment for mass production of chips in the coming years. The tool uses a 0.55 numerical aperture lens (High-NA), thus allowing chipmakers to print smaller features on processors than was previously possible. We previously covered ASML's announcement last month that it had begun shipping the tool to Intel.

The Potential Investment Under the CHIPS and Science Act Would Shore Up Domestic Supply of Microcontroller Chips and Create Over 700 New Jobs.