MALTA, N.Y., February 16, 2026 / TOKYO, Japan, February 17, 2026 — GlobalFoundries (Nasdaq: GFS) (GF) and Renesas Electronics Corporation (TSE: 6723) (Renesas) today announced an expanded strategic collaboration through a multi‑billion-dollar manufacturing partnership that broadens Renesas’ access to GF technologies including its differentiated technology platforms. This agreement reflects a shared commitment to secure, resilient supply chains and aligns with U.S. priorities to strengthen domestic semiconductor production for economic and national security.

The Ministry of Economic Affairs yesterday broke ground on the Industrial Technology Research Institute’s advanced semiconductor research and development (R&D) base in Hsinchu County’s Jhudong Township (竹東).

The NT$3.772 billion (US$119.56 million) base is a joint project with the National Development Council and the National Science and Technology Council as part of the government’s Chip-based Industrial Innovation Program, the ministry said.

MILPITAS, Calif. — February 10, 2026 — Worldwide silicon wafer shipments in 2025 increased 5.8% to 12,973 million square inches (MSI) while wafer revenue slipped 1.2% to $11.4 billion over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.

SEMI 2025 marks an inflection year for wafer shipments, with silicon MSI resuming growth supported by strong demand for advanced epitaxial wafers in logic and polished wafers for high-bandwidth memory (HBM), driven by AI applications. Softness in wafer revenue is mostly attributed to the slow momentum in traditional semiconductor applications where the demand and pricing environment are yet to improve.

LEUVEN (Belgium), FEBRUARY 9, 2026 — Imec – a world-leading R&D center in advanced semiconductor technologies – today inaugurated a 2,000m² cleanroom expansion at its Leuven headquarters, marking a pivotal milestone in the deployment of Europe’s NanoIC pilot line. The event was attended by European EVP Henna Virkkunen, Belgian Prime Minister Bart De Wever, Flemish Minister-President Matthias Diependaele, and ASML CEO Christophe Fouquet, alongside representatives from the European high-tech ecosystem – including industry and startups – the NanoIC pilot line consortium, and policymakers from the EU, Belgium, and Flanders.

MIGDAL HAEMEK, Israel – February 05, 2026 –Tower Semiconductor (NASDAQ/ TASE: TSEM), the leading foundry of high value analog semiconductor solutions, today announced it is scaling AI infrastructure deployments with high performance silicon photonics for 1.6T data center optical modules designed for NVIDIA networking protocols. Tower Semiconductor’s silicon photonics enables up to double the data-rate compared to prior silicon photonics solutions, providing increased bandwidth and throughput for optical connectivity, speeding AI application performance on AI infrastructure.

DALLAS and AUSTIN, Texas, Feb. 4, 2026 /PRNewswire/ -- Texas Instruments (Nasdaq: TXN), a global semiconductor company that designs, manufactures and sells analog and embedded processing chips, and Silicon Labs (Nasdaq: SLAB), a leader in secure, intelligent wireless technology, today announced they have signed a definitive agreement under which Texas Instruments will acquire Silicon Labs for $231.00 per share in an all-cash transaction, representing a total enterprise value of approximately $7.5 billion.

SANTA CLARA, Calif. and TOKYO, Feb. 04, 2026 (GLOBE NEWSWIRE) -- SiTime Corporation (Nasdaq: SITM) (“SiTime” or the “Company”), the Precision Timing company, and Renesas Electronics Corporation (TSE: 6723) (“Renesas”), a premier supplier of advanced semiconductors, today announced that SiTime and Renesas’ consolidated subsidiary, Renesas Electronics America Inc., have signed a definitive agreement whereby SiTime will acquire certain assets related to Renesas’ timing business. The acquisition accelerates SiTime’s path to $1 billion of revenue as the premier pure-play Precision Timing company with an industry leading portfolio to fully meet customers’ needs for high-performance timing products. Additionally, the companies have signed a partnership MOU to explore SiTime’s MEMS resonator integration into Renesas’ embedded computing products.

Munich, Germany – 3 February 2026 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its sensor business with the acquisition of the non-optical analog/mixed-signal sensor portfolio from ams OSRAM Group (SIX: AMS). The two companies have entered into an agreement for a purchase price of €570 million on a debt-free and cash-free basis. With the planned investment, Infineon will strengthen its position as a leader in sensors for automotive and industrial markets through a complementary portfolio and expand its product range in medical applications. The acquired business is expected to generate around €230 million in revenue in calendar year 2026 and will support Infineon's profitable growth. The transaction will be accretive to earnings-per-share immediately upon closing, with future synergies enabling substantial additional value creation. As part of the transaction, around 230 employees with expertise in research and development (R&D) and business management will join Infineon. The agreement includes a multi-year supply agreement with ams OSRAM.

Geneva, February 2, 2026 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today completed the acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business. Announced in July 2025 and now fully approved by regulators, this transaction, focused on automotive safety and non-safety products and sensors for industrial applications, expands ST’s global sensors capabilities.

Hsinchu, Taiwan, January 28, 2026 – Vanguard International Semiconductor Corporation (VIS) announced today that it has signed a technology licensing agreement with Taiwan Semiconductor Manufacturing Company (TSMC) for high-voltage (650V) and low-voltage (80V) Gallium Nitride (GaN) technologies. This agreement will help VIS accelerate the development and expansion of next‑generation GaN power technologies for applications such as data centers, automotive electronics, industrial control, and energy management, which are key areas that demand high‑efficiency power conversion.