TSMC, Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors N.V. Collaborate on Joint Investment in European Semiconductor Manufacturing Company (ESMC) GmbH in Dresden, Germany, Aiming to Establish a 300mm Fab to Meet the Expanding Demands of the Automotive and Industrial Industries. The project's full investment decision is contingent on the determination of public funding support, and it is being pursued within the scope of the European Chips Act.

China imported a total of 270.2 billion units of integrated circuits (IC) in the first seven months of 2023, down 16.8 per cent from the same period last year and showing a modest improving trend despite tougher trade restrictions imposed by the US and its allies.

Toyota Motor China Investment (TMCI), GAC Toyota Motor Co. (GTMC), and Pony.ai have announced they will form a joint venture with the purpose of mass producing Level 4-capable autonomous taxis and deploying these robotaxis at a large scale, the three entities said in a joint statement.

TOKYO - Japan's Toshiba (6502.T) said on Monday a $14 billion tender offer to take the industrial conglomerate private will be launched on Tuesday - an effort that will, if successful, buy out activist investors and return it to domestic hands.

SUBSIDY: Whether the government would pay for half of the second TSMC plant would depend on what type of chips are to be made there, Yoshihiro Seki said.

WASHINGTON — The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $124.5 billion during the second quarter of 2023, an increase of 4.7% over the first quarter of 2023 but 17.3% less than the second quarter of 2022.

Infineon Plans to Establish the World's Largest 200-mm SiC Power Fab in Kulim, Malaysia, with a Significant $5.5 Billion Investment Over 5 Years, Supported by Customer Commitments and Pre-Payments.

STAYING NIMBLE: Although the company said it was cautiously evaluating its capacity expansion, Vanguard would hold to its 6 to 7 percent in planned expansion for this year

GlobalWafers Co, the world’s third-largest silicon wafer supplier, yesterday said that revenue growth this year would be flat or would increase by a low to mid-single-digit percentage, as several of its customers contend with inventory issues.

Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis.