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Industry News

27 May 2025

By CNA

TSMC will open a European chip design centre in Munich, Germany

AMSTERDAM :Taiwan Semiconductor Manufacturing Co, the world's largest contract chipmaker, will open a chip design centre in Munich, Germany, a company executive said on Tuesday.

President of TSMC Europe, Paul de Bot, said at the company's 2025 Technology Symposium event that the Munich Design Centre would open during the third quarter of 2025.

23 May 2025

By Business Times

Foxconn among potential bidders for Singapore chip assembly firm UTAC in US$3 billion deal: sources

[HONG KONG] Taiwan’s Foxconn is among potential bidders for the Singaporean semiconductor assembly and testing business UTAC Holdings in a deal that could value the company at about US$3 billion, two people with knowledge of the matter said.

UTAC’s owner, Beijing-based private equity firm Wise Road Capital, has hired Jefferies to run a sale process and is expecting to field non-binding bids by end of this month, the sources said.

Both the sources declined to be named as the information was confidential.

22 May 2025

By KLA

KLA Invests in Operations in Wales with the Opening of a $138 Million R&D and Manufacturing Facility

MILPITAS, Calif., May 22, 2025 /PRNewswire/ -- KLA Corporation (NASDAQ: KLAC), a global leader in semiconductor process control and process-enabling technology, today announced the opening of its new $138 million research and development (R&D) and manufacturing center in Newport, Wales, U.K., continuing the company's history of regional investment. SPTS, KLA's Wales-based product division, has been leading semiconductor equipment innovation in Wales since 1984, winning multiple Queen's Awards for excellence in R&D and export, and attracting strong technical talent to the region.

22 May 2025

By A*STAR

A*STAR's Inaugural "Innovate Together" Showcases Singapore's Semiconductor Ambitions On Global Stage

SINGAPORE – The Agency for Science, Technology and Research (A*STAR) today hosted the inaugural “Innovate Together” event at SEMICON Southeast Asia 2025, signalling Singapore’s bold ambition to lead in the next phase of semiconductor innovation. Designed as a convergence point for industry, academia, and the public sector, Innovate Together unveiled game-changing initiatives, strategic global partnerships, and new research platforms that will strengthen Singapore’s position as a high-value semiconductor R&D and talent hub.

19 May 2025

By FOXCONN

Hon Hai Technology Group (Foxconn) and France’s Thales Group Announce Strategic Partnership In Semiconductor And Space

19 May 2025, Taipei, Taiwan – Hon Hai Technology Group (“Foxconn”) (TWSE:2317) on Monday announced a strategic partnership with Thales Group of France in the fields of semiconductors and space, a move that deepens the industrial expertise and broadens the European footprint of the world’s largest electronics manufacturing service provider.

Announced at Choose France, a flagship economic summit convened by French PresidentEmmanuel Macron, the first of two MOUs for Foxconn could aggregate additional European industrial investors to sustain an investment in excess of EUR250 million while ensuring a strong European leadership in an outsourced semiconductor assembly and test (OSAT) facility.

17 May 2025

By Taipei Times

GlobalWafers to ramp up US expansion

GlobalWafers Co (環球晶圓), the world’s third-largest silicon wafer supplier, yesterday said that it plans to invest an additional US$4 billion in the US, citing growing demand from US customers seeking locally produced wafers amid ongoing uncertainty over US tariff policies.

The announcement was made at the opening ceremony of the company’s new advanced 12-inch wafer fabrication plant in Sherman, Texas. The latest commitment would bring GlobalWafers’ total investment in the US to US$7.5 billion, the company said.

15 May 2025

By Reuters

India approves HCL-Foxconn joint venture semiconductor unit

NEW DELHI, May 14 (Reuters) - India's cabinet has approved a new semiconductor plant, a joint venture between HCL Group and Taiwan's Foxconn (2317.TW), opens new tab, costing 37.06 billion rupees ($435 million), information minister Ashwini Vaishnaw said on Wednesday.
The plant, which will be located near the Jewar airport in the northern state of Uttar Pradesh, is designed for a capacity of 20,000 wafers per month and can produce 36 million display driver chips, Vaishnaw said at a cabinet briefing in New Delhi.

14 May 2025

By Reuters

Samsung to Acquire German Cooling Systems Maker FlaktGroup (~€1.5 B)

Samsung struck its largest deal since 2017— Samsung Electronics (005930.KS), opens new tab said on Wednesday it had agreed to buy Germany's FlaktGroup for 1.5 billion euros ($1.68 billion) as it looks to meet growing demand for cooling of data centres used for artificial intelligence projects.
In the South Korean company's biggest acquisition in eight years, it will purchase the air conditioning and heating systems maker from private equity group Triton. The deal should close within 2025.

13 May 2025

By NVIDIA

HUMAIN and NVIDIA Announce Strategic Partnership to Build AI Factories of the Future in Saudi Arabia

HUMAIN, the new full AI value chain subsidiary of Saudi Arabia’s Public Investment Fund, today announced a landmark strategic partnership with NVIDIA, the world leader in AI computing infrastructure, to drive the next wave of artificial intelligence development.

The two organizations will leverage NVIDIA platforms and expertise to establish Saudi Arabia as a global leader in AI, GPU cloud computing and digital transformation to drive innovation and growth worldwide.

The partnership underscores HUMAIN’s mission to position Saudi Arabia as an international AI powerhouse — combining cutting-edge infrastructure, frontier AI models, immersive digital platforms and human capital development.

13 May 2025

By AMD

AMD and HUMAIN Form Strategic, $10B Collaboration to Advance Global AI

SANTA CLARA, Calif. and RIYADH, Saudi Arabia, May 13, 2025 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) and HUMAIN, Saudi Arabia’s new AI enterprise, today announced a landmark agreement to build the world’s most open, scalable, resilient, and cost-efficient AI infrastructure, that will power the future of global intelligence through a network of AMD-based AI computing centers stretching from the Kingdom of Saudi Arabia to the United States.

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