top of page
Aesthetic wallpaper_edited_edited_edited_edited.jpg
Image by Philip Oroni

Events

19 February 2025 at Singapore

SAARD - International Conference on Advances in Health and Medical Science (ICAHMS)

About the conference - International Conference on Advances in Health and Medical Science is a prestigious event organizedwith a motivation to provide an excellent international platform for the academicians, researchers, engineers,industrial participants and budding students around the world to SHARE their research findings with the global experts. ICAHMS will be held in Singapore on 19th Feb 2025 .

Aim of the Conference The key intention of ICAHMS 2025 is to provide opportunity for the global participants to share their ideas and experience in person with their peers expected to join from different parts on the world. In addition this gathering will help the delegates to establish research or business relations as well as to find international linkage for future collaborations in their career path. We hope that ICAHMS 2025 outcome will lead to significant contributions to the knowledge base in these up-to-date scientific fields in scope.

19 - 21 February 2025 at COEX, Seoul, Korea

SEMICON Korea 2025

This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including Semiconductor Technology Symposium, Market Trend Forum and Supplier Search Program. This will be a real and strategic opportunity to examine the present and future of the global semiconductor industry.

18 - 20 February 2025 at San Francisco, CA

SMTA Wafer-Level Packaging Symposium

Formatting Advanced Packaging for the AI Era
The evolution of Advanced Package Technology is experiencing substantial changes as system designs directly drive package performance requirements—an unprecedented development in the industry. Historically, architects constructed circuits within packaging constraints to prevent undesirable outcomes. Nevertheless, increasing transistor expenses and the demand for improved power efficiency necessitate advancing package technologies beyond conventional limits. The Wafer-Level Packaging Symposium will bring together the foremost experts in the semiconductor industry to examine all aspects of wafer-level packaging, 3D device packaging, advanced manufacturing, and testing technologies. Positioned at the forefront of packaging technology evolution, this conference offers global attendees the chance to engage with the latest technological and business trends in the heart of Silicon Valley.

25 - 30 January 2025 at San Francisco, California, US

SPIE Photonics West

The world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics

7 - 11 December 2024 at Hilton San Francisco Union Square Hotel, San Francisco, CA, USA

70th annual IEEE International Electron Devices Meeting (IEDM 2024)

Shaping Tomorrow’s Semiconductor Technology

1 - 6 December 2024 at Hynes Convention Center, Boston, MA, USA

2024 Materials Research Society (MRS) Fall Meeting & Exhibit

Step into the forefront of scientific discovery at the world’s leading international scientific gathering for materials research—the 2024 MRS Fall Meeting & Exhibit. Our annual fall event returns to the culturally-rich city of Boston, Massachusetts the week of December 1-6, 2024, and will take place at the Hynes Convention Center and adjacent Sheraton Boston Hotel.

14 - 18 October 2024 at Fort Lauderdale, FL, USA

2024 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)

The IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) technical sub-committees are organized to reflect the rapidly evolving developments in bipolar, BiCMOS and compound semiconductor circuits and devices. Submissions are encouraged in all areas of advanced circuits, devices and modeling, with particular emphasis on:

• Bipolar/BiCMOS devices, circuits and technologies
• 5G ICs, GaN HPAs/LNAs, InP THz PAs
• High Performance RF Switch Technologies
• GaN HEMT and other wide bandgap power devices
• Analog, RF & Microwave ICs
• mmW & THz ICs
• Process & Device Technology
• Modeling/Simulation
• Optical CMOS/SiGe Transceivers
• High Speed Digital, Mixed Signal, and Electro-Optic IC’s

22 - 27 September 2024 at Paris Expo, Porte de Versailles, Paris, France

27th European Microwave Week (EuMW 2024)

The European Microwave Association (EuMA) is an international non-profit association with a scientific, educational and technical purpose. The aim of the Association is to develop in an interdisciplinary way, education, training and research activities, including:

Promoting European microwaves
Networking and uniting microwave scientists and engineers in Europe
Providing a single voice for European microwave scientists and engineers in Europe
Promoting public awareness and appreciation of microwaves
Attaining full recognition of microwaves by the European Union
Organizing European Microwave Symposia and, in particular, the European Microwave Conference (EuMC) and the European Microwave Week (EuMW), as well as all the associated events
Circulating information among European microwave scientists and engineers

11 - 13 September 2024 at Greater Noida, Delhi NCR India

SEMICON India 2024

Please save the date for India’s premier semiconductor event, the inaugural SEMICON India 2024, September 11-13, in New Delhi. Co-located with electronica India and productronica India, the exhibition and conference will feature hallmark SEMICON networking opportunities and presentations by thought leaders from across the global semiconductor design and manufacturing supply chain. The co-location replicates the successful model of SEMICON Europa and will incorporate support from local industry association partners to connect the world with India’s fast-growing electronics ecosystem.

4 - 6 September 2024 at TaiNEX 1&2, Taipei, Taiwan

SEMICON Taiwan 2024

This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event showcases how members of the semiconductor community collaborate to drive the unstoppable wave of AI.

The event features themed pavilions and innovation zones dedicated to green manufacturing, heterogeneous integration, materials, Taiwan localization, testing, and workforce development. New pavilions focusing on AI, smart mobility, silicon photonics, and precision machinery have also been introduced to align with evolving market trends and demands.

  • 13
    Page 11

60 Paya Lebar Road #07 - 54
Paya Lebar Square

Singapore 409051

  • LinkedIn

© 2025 by HPS Partners. Powered and secured by Wix

bottom of page