Events

Theme: "Transform Tomorrow," focusing on the end-to-end technology innovation ecosystem.
Established in 1993, SEMICON Southeast Asia is the region’s premier electronics manufacturing and R&D exposition, connecting industry leaders to the latest market trends and technological innovations. The event serves as a critical bridge for decision-makers to showcase advanced products and solve complex industry challenges through collaboration. Moving to the Malaysia International Trade and Exhibition Centre (MITEC) in 2026, the show continues to drive regional growth by highlighting cutting-edge chip technologies and dedicated workforce development initiatives.

SEMIEXPO Heartland 2026 bridges the automotive and semiconductor sectors to explore the future of mobility and manufacturing. The event showcases how AI, chiplets, and digital twins are revolutionizing vehicle design and automated production through expert-led keynotes and panel discussions. Beyond technology, the program features dedicated workforce development sessions aimed at strengthening the talent pipeline and industry-academia partnerships to sustain growth in these evolving high-tech fields.

The leaders building the future of AI infrastructure are gathering in Silicon Valley.

From compute acceleration to next-gen hardware, the executives shaping the global semiconductor roadmap are officially confirmed for the ISIG Executive Summit USA 2026.

Under this year’s theme "Scaling AI: Hardware Innovation, Compute Acceleration & Next-Gen Infrastructure", we bring together visionaries driving breakthroughs in manufacturing, packaging, photonics, data centers, and silicon platforms.

DATE conference is the main European event bringing together designers and design automation users, researchers and vendors, as well as specialists in the hardware and software design, test and manufacturing of electronic circuits and systems. DATE puts a strong emphasis on both technology and systems, covering ICs/SoCs, reconfigurable hardware and embedded systems, and embedded software.

Hear research presented at the only cross-disciplinary event highlighting compelling optics and photonics technologies—from digital optics to quantum technologies to optical imaging, sensing, and metrology. Additional topics include THz photonics, 3D printed optics, photonic glasses, photosensitive materials, and biophotonics.

The "Grand Opening Keynote" marks the start of SEMICON and FPD China. High-profile industry leaders will give keynote speeches, sharing insights on the global industry landscape, technology trend, and market. It is a golden opportunity to exchange ideas with the top global semiconductor industry leaders.

As the premier global forum for microelectronics reliability, the event will gather engineers and scientists to explore the physics of failure in semiconductor devices and systems. The 2026 symposium is set to focus on the reliability challenges of emerging technologies, particularly in AI and high-performance computing (HPC) workloads.

Sponsored by the Accellera Systems Initiative, this upcoming event will serve as the premier technical forum for design and verification professionals to explore the latest tools, standards, and methodologies. The 2026 program will place a significant focus on Artificial Intelligence (AI) and its potential to resolve the "verification bottleneck".

This symposium hosts leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications.

Organized by SMTA, this upcoming event will focus on the rapid evolution of advanced packaging technologies essential for the next generation of AI and high-performance computing. The symposium will explore how system architectures are now directly driving package performance requirements, moving beyond traditional monolithic single-die packaging.