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Events

26 - 29 July 2026 at Long Beach, California

DAC 2026: The Chips To Systems Conference

The Long Beach Convention Center will serve as a dynamic venue for DAC 2026: The Chips to Systems Conference. Set along the scenic Southern California coastline, the center offers modern meeting spaces and a vibrant setting that reflects the innovative spirit of DAC. Its central location in downtown Long Beach provides easy access to hotels, dining, and entertainment, making it an ideal hub for bringing together industry leaders, researchers, and practitioners to explore the future of design automation from chips to systems.

22 - 24 July 2026 in Zagrab, Croatia

The 9th International Congress on Advanced Materials Science and Engineering (AMSE-2026)

The 9th International Congress on Advanced Materials Science and Engineering (AMSE-2026), organized by the International Science and Technology Conference Institute (ISTCI), serves as a premier global platform for academic researchers, industrial practitioners, and technology innovators to share cutting-edge breakthroughs. The event features over 200 oral presentations focusing heavily on advanced functional materials, nanomaterials, biomaterials, biodevices, and environmental technologies designed for energy and sustainability.

20 - 21 July 2026 in Paris, France

Global Summit on Optics, Photonics and Laser Technologies (GPOL 2026)

Theme: Shaping Tomorrow: Breakthroughs in Lasers, Photonics & Optics Driving Technological Innovation This international summit will bring together optical scientists, photonics researchers, laser technology experts, academicians, and industry professionals to share knowledge, explore innovations, and build meaningful collaborations.

13 – 15 July 2026, at the Hayes Mansion in San Jose, California, US

SEMI Strategic Materials Conference (SMC 2026)

Beyond the AI boom lies a challenge—and opportunity—that is far more foundational: ensuring the materials ecosystem underpinning a $2.5 trillion industry is resilient enough to support the next era of innovation. As artificial intelligence accelerates demand for advanced hardware, energy infrastructure, and high‑performance components, the pressure on global materials supply chains has never been greater.

This year, SMC explores how industries can achieve scale readiness through smarter design, diversified sourcing, sustainable processes, and breakthrough materials science. It invites leaders to look past the excitement of AI itself and toward the essential building blocks that will determine whether this technological revolution is secure and sustainable.

The Strategic Materials Conference—SMC offers valuable content and unprecedented networking opportunities for semiconductor industry professionals who share common strategic objectives on materials innovation, management, and business success.

12 - 16 July 2026 at Sheratoon Ann Arbor Hotel, Ann Arbor, MI, USA

24th International Conference on Molecular Beam Epitaxy (ICMBE 2026)

The 24th International Conference on Molecular Beam Epitaxy (ICMBE 2026) provides a prominent international forum for reporting new developments in the areas of fundamental and applied molecular beam epitaxy research, including advances in the technique, synthesis of new materials, discovery of new physical properties, formation of novel heterostructures and nanostructures, and the development of innovative devices.

28 June - 1 July 2026 at JW Marriott Water Street, Tampa, Florida.

ALD/ALE 2026: AVS 26th International Conference on Atomic Layer Deposition (ALD 2026)

The AVS 26th International Conference on Atomic Layer Deposition (ALD 2026) featuring the 13th International Atomic Layer Etching Workshop (ALE 2026) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists.

16 - 17 June 2026 in Ludwigsburg, Germany

Automotive Electronics Congress; Europe’s Leading Conference for SDV, AI & Automotive Silicon Strategy

The AEK 2026 motto highlights the importance of disruptive technologies and open ecosystems as key enablers of innovation. Consumer-centric mobility requires architectures that can evolve continuously, integrate new functions efficiently, and support rapid innovation cycles without compromising safety or reliability. Future-proof E/E architectures are therefore not only a technical necessity, but a strategic prerequisite for competitiveness in a software-driven automotive world.

At AEK 2026, industry leaders from OEMs, Tier 1 suppliers, and technology providers will explore how AI-powered systems, next-generation E/E architectures, and collaborative ecosystems are reshaping vehicle development and production. The conference will focus on real-world implementation, scalability, and the transition from innovation to series production.

14 – 18 June 2026 at the Hilton Hawaiian Village in Honolulu, Hawaii, US

IEEE VLSI Technology & Circuits Symposium 2026

This premier event, now in its 46th year, will be held under the theme "Advancing the AI Frontier through VLSI Innovation". The upcoming symposium will explore how VLSI technology and circuits enable applications like artificial intelligence, machine learning, 6G connectivity, and quantum computing.

2 - 5 June 2026 at Taipei Nangang Exhibition Center, Taiwan

COMPUTEX Taipei 2026

COMPUTEX is a leading global exhibition focused on AIoT and startups.
The expo will theme “AI Together”, featuring the latest tech trends: AI & Computing, Robotics & Mobility, and Next-Gen Tech. Recognized for its adaptability to industry changes. It has established itself as a premier platform for showcasing technological innovations.

26 – 29 May 2026, at the JW Marriott & The Ritz-Carlton Orlando, Grande Lakes in Orlando, Florida, US

ECTC 2026 (Electronic Components and Technology Conference)

The conference will emphasize the theme "The Light Age: Strategic Investment in Photonics to Power the Next Computing Era," particularly focusing on how advanced packaging enables the massive computing power required for AI infrastructure and data centers.

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