Events

DAC is recognized as the global event for chips to systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors. The conference is sponsored by the Association for Computing Machinery (ACM) and the Institute of Electrical and Electronics Engineers (IEEE) and is supported by ACM's Special Interest Group on Design Automation (SIGDA) and IEEE's Council on Electronic Design Automation (CEDA).

DRC 2025 | The 83rd Device Research Conference

This year marks the 83rd anniversary of the DRC—the longest-running device research meeting in the world. The high-caliber technical sessions are highlighted by plenary talks and invited talks by international research pioneers and leaders behind modern electronic technology.

We introduce Conditional Acceptance in our review process, allowing authors to receive feedback and make revisions. This ensures that your paper meets the quality standards and has the best chance of acceptance.

We introduce the RFIC Integrated Systems and Applications category. It welcomes presentations of complete systems based on both new and pre-published chips.

“Cultivating the VLSI Garden: From Seeds of Innovation to Thriving Growth“​

Med-Tech Innovation Expo event brings together leaders, engineers, innovators and manufacturers, connecting them with technology and innovation to facilitate the design and manufacture of life changing medical devices.

The UK MedTech industry has an annual turnover of over £27.6 billion. The UK is also a major player in the international market, exporting over £5.6 billion of MedTech products in 2021.

As the home of medical device manufacturing in the UK, Med-Tech Innovation Expo is at the centre of this exciting sector and the exhibition showcases the entire ecosystem of market leading technology suppliers, machines, materials, software and service providers.

Join our community of thinkers and doers in design, manufacturing and lifecycle management to accelerate your digital transformation.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.

Forward-thinking semiconductor organizations are implementing practices to reduce the environmental impact of their businesses and manufacturing operations to ensure their resiliency when disruptive events such as geopolitical conflicts, climate-related disasters, and public health crises strike. Initiatives focused on reducing greenhouse gas emissions and water use, deploying renewable energy systems, and improving the energy efficiency of chipmaking equipment are growing in importance.

To thrive in the coming decade and beyond, companies must look beyond short-term performance and focus on building resilience to better withstand unpredictable disruptions to their businesses, the semiconductor industry and global economies.

Join us for the User2User North America event, which is a dedicated environment for exchanging ideas, information, and best practices that enable you to lead in your role and achieve success with your customers.

Join us in Munich where peer-delivered technical sessions will be shared across a breadth of topics so you can explore new concepts or dive deep in your core area of expertise with fellow like-minded professionals.